Hot Semiconductor Companies To Buy For 2014

It might not be obvious to the casual observer, but right now, today, LSI (NASDAQ: LSI  ) stock offers one of the best values available in the semiconductor industry. Why?

Three reasons.

LSI is cheaper than it looks
When you stack up LSI stock against a couple of its larger competitors -- Marvell Technology (NASDAQ: MRVL  ) and Texas Instruments (NASDAQ: TXN  ) , it's not immediately clear that LSI is a bargain. Right off the bat, you can see that the stock sells for 30 times earnings -- while TI costs only 23.3 times earnings, and Marvell costs an even 22.0.

That said, looks can be deceiving. You've seen how LSI looks relative to its rivals today. But now take a look at how the stock might look to investors a year from now. Let's take a gander at these companies' "forward" price-to-earnings ratios:

So if you go out 12 months, and look at where LSI might be in a year, what you get is nearly a mirror image of where things stand today. Far from being the most expensive stock in the industry, it turns out LSI could soon be the cheapest.

Top 10 Media Companies To Own For 2015: Applied Materials Inc.(AMAT)

Applied Materials, Inc. provides manufacturing equipment, services, and software to the semiconductor, flat panel display, solar photovoltaic (PV), and related industries worldwide. The company?s Silicon Systems Group segment offers a range of manufacturing equipment used to fabricate semiconductor chips or integrated circuits. This segment provides systems that perform primary processes used in chip fabrication, including atomic layer deposition, chemical vapor deposition, physical vapor deposition, electrochemical deposition, rapid thermal processing, chemical mechanical planarization, wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. Its Applied Global Services segment offers products and services designed to enhance the performance and productivity, and reduce the environmental impact of the fab operations of semiconductor, liquid crystal displays (LCDs), and solar P V manufacturers. The company?s Display segment provides products for manufacturing thin film transistor LCDs for televisions, personal computers (PCs), tablet PCs, smartphones, and other consumer-oriented electronic applications. Its Energy and Environmental Solutions segment offers manufacturing systems for the generation and conservation of energy, as well as manufacturing solutions for wafer-based crystalline silicon applications. This segment also provides roll-to-roll vacuum Web coating systems for deposition of a range of films on flexible substrates for functional, aesthetic, or optical properties; and roll-to-roll machine for depositing ultra-thin aluminum films for flexible packaging applications. The company serves manufacturers of semiconductor wafers and chips, flat panel LCDs, solar PV cells and modules, and other electronic devices. Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California.

Advisors' Opinion:

• [By Jayson Derrick]

  Analysts at Bank of America upgraded Applied Materials (NASDAQ: AMAT) to Buy from Neutral with a $25 price target. Shares gained 0.47 percent, closing at $19.42.

• [By Lu Wang]

  Red Hat Inc. slumped 12 percent after billings at the largest seller of the Linux operating system trailed estimates. Homebuilders gained 2.3 percent as a group after a report showed home prices increased by the most in more than seven years and Lennar Corp.�� profit beat analyst estimates. Applied Materials Inc. (AMAT) advanced 9.1 percent after agreeing to buy Tokyo Electron Ltd. for about $9.39 billion in stock.

Hot Semiconductor Companies To Buy For 2014: Taiwan Semiconductor Manufacturing Co Ltd (TSM)

Taiwan Semiconductor Manufacturing Co., Ltd. is a Taiwan-based company principally engaged in the research, development, manufacture and distribution of integrated circuit (IC) related products. The Company operates its businesses through wafer manufacture, mask production, wafer testing and packaging components. The Company also involves in the provision of production management, customer services and design services. Its products and services are applied in the manufacture of personal computers and peripheral products, information related products, wire and wireless communication systems, automobile and industrial equipment, as well as consumer electronic products, such as digital disk players, digital televisions (TVs), game consoles, digital cameras, among others. Its customers include Altera, AMD, Broadcom, Marvell, NVIDIA, Qualcomm, Analog Devices, Freescale, NXP and Texas Instruments, among others. In July 2010, Taiwan Semiconductor Manufacturing Co. acquired mechanical and engineering equipment from ASML HONG KONG LTD. In September 2010, the Company acquired a set of equipments from ASML HONG KONG LTD. In December 2010, the Company acquired a set of equipment from TOKYO ELECTRON LTD., KLA-TENCOR CORP. and NOVELLUS SYSTEMS INTERNATIONAL,B.V. In January 2011, the Company announced that it had acquired a set of equipment from KLA-TENCOR CORP., a set of equipment and facility, and another set of equipment from VARIAN SEMI. EQUIP. ASSOCIATES GmbH. In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc.In March 2011, the Company acquired a set of equipments from Rudolph Technologies, Inc. In May 2011, it acquired a set of equipments form APPLIED MATERIALS SOUTH EAST ASIA PACIFIC LTD., Hamatech APE Gmbh and CO. KG, TOKYO ELECTRON LTD., DAINIPPON SCREEN MFG. CO., LTD., and VARIAN SEMI. EQUIP. ASSOCIATES GMBH.

TSMC's customers include semiconductor companies, ranging from fabless semiconductor and systems companies, such as Advanced Micro Devices, In! c., Altera Corporation, Broadcom Corporation, Marvell Semiconductor Inc., MediaTek Inc., nVidia Corporation and Qualcomm Incorporated, to integrated device manufacturers, such as LSI Corporation, STMicroelectronics and Texas Instruments Inc. Fabless semiconductor and system companies accounted for approximately 80%, and integrated device manufacturers accounted for approximately 20% of its net sales as of December 31, 2009.

The Company manufactures semiconductors using CMOS and BiCMOS processes. The BiCMOS process combines the speed of the bipolar circuitry and the power consumption and density of the CMOS circuitry. It uses the CMOS process to manufacture logic semiconductors, memory semiconductors, including static random access memory (SRAM), flash memory, mixed-signal/ radio frequency (RF) semiconductors, which combine analog and digital circuitry in a single semiconductor, micro-electro-mechanical-system (MEMS), which combines micrometer featured mechanical parts, analog and digital circuitry in a single semiconductor, and embedded memory semiconductors, which combine logic and memory in a single semiconductor. The BiCMOS process is used to make high-end mixed-signal and other types of semiconductors.

Advisors' Opinion:

• [By Ashraf Eassa]

  But it is widely rumored that Apple will be moving its chip business to independent semiconductor foundry�Taiwan Semiconductor (NYSE: TSM  ) �for the iPhone 6.

• [By Evan Niu, CFA]

  Apple (NASDAQ: AAPL  ) wants to move away from Samsung. This we know. While the South Korean conglomerate has many independent divisions, Apple doesn't like giving the component segment business while the smartphone segment is its most viable competitor. To that end, the surest signs yet have emerged that Apple has inked a three-year deal with Taiwan Semiconductor (NYSE: TSM  ) .

Hot Semiconductor Companies To Buy For 2014: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:

• [By Alexis Xydias]

  The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.

• [By Namitha Jagadeesh]

  The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.

• [By Adam Haigh]

  ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.

Hot Semiconductor Companies To Buy For 2014: Aeroflex Holding Corp (ARX)

Aeroflex Holding Corp. (Aeroflex Holding) is a provider of radio frequency (RF) and microwave integrated circuits, components and systems used in the design, development and maintenance of wireless communication systems. The Company�� solutions include microelectronic components and test and measurement equipment used by companies in the space, avionics and defense; commercial wireless communications, and medical and other markets. Its products include a range of RF, microwave and millimeter wave microelectronic components, integrated circuits (ICs), and analog and mixed-signal devices. It also manufactures a range of RF and microwave wireless radio and avionics test equipment and solutions particularly for the wireless, avionics and radio test markets. The Company operates in two segments: Aeroflex Microelectronics Solutions (AMS) and Aeroflex Test Solutions (ATS). In August 2010, it acquired Advanced Control Components. In September 2013, the Company announced the sale of its Aeroflex Test Equipment Services (ATES) business to Trescal Limited. In February 2014, Aeroflex Holding Corp announced the acquisition of Shenick Network Systems.

Aeroflex Microelectronic Solutions

AMS offers a range of microelectronics products and is a provider of specialty products for the space, avionics, defense, commercial wireless communications, medical and other markets. RadHard products are specifically designed to tolerate high radiation level environments, which otherwise can degrade electronic components. The Company principally operates on a fabless semiconductor manufacturing model, outsourcing virtually all front-end semiconductor fabrication activities to commercial foundries. AMS offers a range of complementary products that provide connectivity and computing functionality for applications. Its product portfolio includes RF, microwave and millimeter wave products, including discrete components, ICs, monolithic microwave ICs and multi-chip modules.

AMS designs and manu! factures application specific, analog and mixed-signal devices for use in medical, industrial and intelligent sensors. The Company�� AMS products are used in over 100 space, avionics and defense platforms, including the Wideband Global Satellite Communications satellites, the Geostationary Operational Environmental satellites, the Advanced Extremely High Frequency satellites, the Boeing 777 airliner's databus, the F-16's modular mission computer, the B-1 flight controls upgrade and the Terminal High Altitude Area Defense program. Its AMS products are also used in wireless communications platforms, including WCDMA and LTE cellular base station systems, as well as point-to-point broadband radio applications. In the medical area, our products are used by two of the top four manufacturers of CT scan equipment.

AMS provides HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, global positioning systems (GPS) receivers, networking and telecommunication markets. AMS' HiRel products include transceivers, analog multiplexers, clock management generators, MSI logic products, battery electronics units, voltage regulators, high-speed power controllers, MIL-STD 1553 bus controllers, remote terminals, bus monitors, microcontrollers and microprocessors, RadHard Pulse Width Modulation Controllers, RadHard Resolver-to-Digital and memory modules. HiRel Microelectronics/ Semiconductors have a typical life cycle of 10-20 years.

AMS provides a set of standard and application specific RF/microwave diodes and semiconductor devices. Microwave semiconductor products offered include diodes, amplifiers, resistors, inductors, capacitors, switches, and integrated devices. RF and Microwave active components and subsystems offered include PIN diode-based microwave control components, variable attenuators, phase shifters, limiters, time delay units and Multi-Funct! ion Micro! wave assemblies. AMS offers resistor products, which include a variety of low and high reliability power surface mounted passive devices for the wireless infrastructure and defense markets with applications in isolators, circulators, single and multi-carrier power amplifiers and circuits. Passive components offered include attenuators, terminations, adapters, DC blocks, and other components for commercial, military and laboratory applications. Other products include power amplifiers, up and down converters, mixers, filters and micro-receivers operating to over 40 giga hertz (GHz). RF and Microwave components have a typical life cycle of 5-15 years. The Company�� motion control products provide complete and integrated motion control solutions for space (both military and commercial), military, avionics, and industrial customers. Its product line offerings include actuators and mechanisms, electronic controllers, slip rings and twist capsules, DC motors and Gimbal Systems. Motion control products have a typical life cycle of 10-20 years.

Aeroflex Test Solutions

ATS is a provider of a line of specialized test and measurement hardware and software products, primarily for the space, avionics, defense, commercial wireless communications and other markets. ATS products and their applications include wireless test equipment, which is used to develop and test handsets and base stations; military radio and PMR test equipment, which is used by radio manufacturers and military, police, fire, and emergency response units to test handheld radios; avionics test equipment, which is used in the design, manufacture and maintenance of electronics systems for aircraft; synthetic test equipment, which is used to test satellites and transmit / receive modules prior to launch and deployment, and general purpose test equipment, including spectrum analyzers and signal generators.

Wireless Test Equipment is used by wireless service providers and equipment manufacturers to test wireless ! handsets ! and base stations. The Company offers a range of cellular tests across a range of wireless standards and communication frequencies, including 2G and 3G, with particular capability in EDGE protocols, and the new 4G LTE/LTE(A) protocols. Products include a range of system, protocol, physical layer and parametric test solutions, such as the TM500 test mobile, RF synthesizers, digitizers and combiners, and application software. In addition, ATS provides PXI-based products which are modular scalable solutions for the handset manufacturing environment. Product applications include research and development, conformance, manufacturing/production, installation and commissioning, field service, and network optimization.

ATS Radio Test Equipment is used by radio manufacturers and military, police, fire and emergency response units to test handheld radio units. ATS provides TErrestrial Trunked Radio (TETRA), and Project 25 (P25), radio test equipment, addressing both mobile and repeater test applications. TETRA is a global standard for private mobile radio (PMR), systems used by emergency services, public transport and utilities. P25 is a standard for digital radio communications for use by federal, state, private, and local public safety agencies in North America. Its military communications testing systems are primarily used by the United States military to test complex voice and data frequency hopping radios and accessories. Military radio and PMR test equipment has a typical life cycle of 5-20 years.

Avionics test equipment is used in the design, manufacture, test and maintenance of commercial, civil and military airborne electronic systems, or avionics. ATS equipment provides the stimulus and signals necessary for certification, verification, fault finding and diagnosis of airborne systems on the ground. For civil and commercial aviation, it has test solutions for various transponder modes, communications frequencies, emergency locator transmitters, weather radars and GPS systems. F! or milita! ry aviation, it has test solutions for microwave landing systems, tactical air navigation, enhanced traffic alert and collision avoidance systems, various identification friend or foe, or IFF, transponder/interrogator modes and IFF monopulse antenna simulation. ATS also provides customized avionics test solutions to support manual and automatic test equipment for manufacturing, repair and ground support operations. Avionics test equipment has a typical life cycle of 8-15 years.

Synthetic test systems test several attributes through one box and can take multiple complex measurements simultaneously. ATS provides synthetic test environment that allows digital, analog, RF/microwave and power test of circuits, modules, subsystems and complete systems for commercial, military, and aerospace customers. ATS' STI 1000C+ and TRM 1000C products offer synthetic microwave test systems optimized for testing Transmit/Receive modules and satellite payloads in a factory setting. Its SMART^E and SMART^E 5300 products offer a modular approach for implementing multi-function configurable and reconfigurable test systems. Synthetic test solutions products have a typical life cycle of 10-15 years.

ATS offers a variety of general purpose test solutions including microwave test solutions, counters and power meters. ATS microwave test solutions cover frequency ranges from 1 megahertz (MHz) to 46 gigahertz (GHz), with various tracking, offset, continuous wave, modulated source, fault location, and group delay configuration options provided. ATS power meters are designed for field use, automated test equipment requirements and standard bench applications. General purpose test solutions have a typical life cycle of 4-7 years.

The Company Competes with Agilent Technologies, Honeywell, BAE Systems, Hittite Microwave Corporation, ILC / Data Devices Corporation, Microsemi, Anaren, Anite, Anritsu, Rohde & Schwarz, Spirent and National Instruments.

Advisors' Opinion:

• [By Rich Smith]

  The Department of Defense issued some 22 separate contract awards Thursday, totaling just under $1 billion in combined value. Not all of them went to publicly traded defense contractors, of course, but enough of them did to be worth mentioning. Here are a few of the lucky winners:

• [By Jake L'Ecuyer]

  Leading and Lagging Sectors
  In trading on Tuesday, technology shares were relative leaders, up on the day by about 0.12 percent. Leading the sector was strength from Aeroflex Holding (NYSE: ARX) and Canadian Solar (NASDAQ: CSIQ). Cyclical consumer goods & services shares declined around 0.71 percent in Tuesday's trading.

Hot Semiconductor Companies To Buy For 2014: Intermolecular Inc (IMI)

Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.

As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics and analysis software. Tempus HPC processing are used to process ! different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.

The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.

Advisors' Opinion:

• [By Jake L'Ecuyer]

  Leading and Lagging Sectors
  Technology shares gained about 0.68 percent in today's trading. Meanwhile, top gainers in the sector included Intermolecular (NASDAQ: IMI), up 38.3 percent, and Infinera (NASDAQ: INFN), up 9.4 percent. In trading on Monday, utilities shares were relative laggards, down on the day by about 0.68 percent.

• [By Sofia Horta e Costa]

  ARM Holdings Plc (ARM) lost 2.6 percent, leading European technology companies lower before it publishes half-year results next week. IMI Plc (IMI) gained 2 percent as Citigroup Inc. listed the engineering company among its most preferred stocks.

• [By Lisa Levin]

  Intermolecular (NASDAQ: IMI) shares touched a new 52-week low of $4.84. Intermolecular shares have dropped 45.09% over the past 52 weeks, while the S&P 500 index has gained 26.39% in the same period.

Hot Semiconductor Companies To Buy For 2014: Micropac Industries Inc (MPAD)

Micropac Industries, Inc. (Micropac), incorporated on March 3, 1969, manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power operational amplifiers, and optoelectronic components and assemblies. Micropac�� products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature (200o degree Celsius) products. The Company�� products are either custom (being application-specific circuits designed and manufactured to meet the particular requirements of a single customer) or standard components. During the fiscal year ended December 31, 2011 (fiscal 2011), its custom-designed components accounted for approximately 34% of its revenue and standard components accounted for approximately 66% of its revenue.

Micropac occupies approximately 36,000 square feet of manufacturing, engineering and office space in Garland, Texas. The Company owns 31,200 square feet of that space and leases an additional 4,800 square feet. It also sub-contracts some manufacturing to Inmobiliaria San Jose De Ciuddad Juarez S.A. DE C.V, a maquila contract manufacturer in Juarez, Mexico.

Micropac provides microelectronic and optoelectronic components and assemblies along with contract electronic manufacturing services, and offers a range of products sold to the industrial, medical, military, aerospace and space markets. The Microcircuits product line includes custom microcircuits, solid state relays, power operational amplifiers, and regulators. During fiscal 2011, microcircuits product line accounted for 51% of its revenue and the optoelectronics product line accounted for 62% of its business respectively. The Company�� core technology is the packaging and interconnects of miniature electronic components, utilizing thick film and thin film substrates, forming microelectronics circuits. Other technologi! es include light emitting and light sensitive materials and products, including light emitting diodes and silicon phototransistors used in its optoelectronic components, and assemblies.

The Company�� basic products and technologies include custom design hybrid microelectronic circuits, solid state relays and power controllers, custom optoelectronic assemblies and components, optocouplers, light-emitting diodes, Hall-Effect devices, displays, power operational amplifiers, fiber optic components and assemblies, and high temperature (200o degree Celsius) products. Micropac�� products are primarily sold to original equipment manufacturers (OEM��) who serve major markets, which includes military/aerospace, such as aircraft instrumentation, guidance and navigations systems, control circuitry, power supplies and laser positioning; space, which include control circuitry, power monitoring and sensing, and industrial, which includes power control equipment and robotics.

The Company�� products are marketed throughout the United States and in Western Europe. During fiscal 2011, approximately 21% of the Company�� revenue was from international customers. The Company�� major customers include contractors to the United States Government. During fiscal 2010, sales to these customers for the Department of Defense (DOD) and National Aeronautics and Space Administration (NASA) contracts accounted for approximately 62% of its revenues. The Company�� customers are Lockheed Martin, Northrop Grumman, Boeing, Rockwell Int��, and NASA.

The Company compete with Teledyne Industries, Inc., MS Kennedy, Honeywell, Avago and International Rectifier.

Advisors' Opinion:

• [By Geoff Gannon] % of NCAV, has similar (slightly better) z- and f-scores, a FCF margin of 6%, but has ROA of 28%.
  
  ADDvantage (AEY) sells at 95% of NCAV, has similar (in the ballpark) scores and FCF and ROA of 23%.

  The slightly better businesses are currently more expensive in terms of price/NCAV. They have less asset-based downside protection, but they are better businesses.

  How do you quantify and qualify what is cheap enough? To me, there's a big difference in relative cheapness in a company selling at 74% of NCAV versus one selling at 95%. I'm wondering if I'm putting too much weight on this cheapness measurement instead of acknowledging that any decent business selling at less than NCAV is cheap enough. Yet, one has to have some quantifiable idea of when something is not cheap enough anymore.

  Can you help me put this into a unified framework?

  Dan

  There�� a great post over at Oddball Stocks called: �� Stock is a Business�� Read it. Then go over to Richard Beddard�� Interactive Investor Blog. Bookmark that blog. Read it religiously. He looks at Ben Graham type stocks in the U.K. And he looks at them not just as stocks but as pieces of a business.

  Here�� what Richard said in a post called ��iving Up on Mastery of the Universe��

  I need to know:

  1. Whether the managers have made good decisions in the past, and whether their incentives work in the interests of the owners, because those kind of managers often add value to a company.

  2. The products a company sells will still be in demand for years to come, because if they��e not then the past, which we know, does not tell us anything about the future, which we don��.

  3. A company is financially strong enough to withstand the kinds of shocks companies typically experience bearing in mind some are more sensitive to events than others.

  4. How to judge whether the share price undervalues the company, bearing in mind the preceding three factors.